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Master Bond Consumable

Epoxy Adhesive Films & Preforms

Model FLM36, FL901S, FL901AO

Electronic grade epoxy films and preforms with ambient storage stability, fast cures and uniform bond lines, including silver-filled and thermally conductive grades.

Description

Master Bond epoxy films and preforms are ready to use, stay in place after application and give uniform, narrow bond lines. They can be supplied in intricate shapes for high volume production.

Featured grades

  • FLM36 – B-staged, thermally conductive and electrically insulative film; -100°F to +500°F
  • FL901S – silver filled for electrical and thermal conductivity; -100°F to +500°F
  • FL901AO – thermally conductive, electrically insulative; -100°F to +400°F

Applications

  • Substrate attachment and heat sink bonding
  • Lid sealing, hybrids and connectors
  • EMI/RFI shielding and static dissipation
  • Structural bonding

Specifications

FLM36 service range-100°F to +500°F
FL901S service range-100°F to +500°F
FL901AO service range-100°F to +400°F

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