Master Bond Consumable
Potting and Encapsulation Compounds
Epoxy, silicone, polyurethane and UV curable potting systems for low to high voltage electronics, including marine modules and submersible pumps.
Description
Master Bond potting, encapsulation and casting materials protect power supplies, switches, ignition coils, electronic modules, motors, connectors, sensors, cable harnesses, capacitors, transformers and rectifiers. The company cites their use in marine modules and submersible pumps, with protection against abrasion, shock, vibration, impact, UV, fungus and moisture, including salt water immersion.
Key features
- Enhanced thermal management and low CTE
- Crack resistance; cryogenic to elevated temperature service
- Tamper proofing
- Select grades meet UL 94V-0, UL 746A, UL 94HB, UL 1203 (explosion-proof), NASA low outgassing, USP Class VI and FDA CFR 175.300
Applications
Encapsulation of marine electronics, submersible pump components, sensors and power electronics exposed to moisture and salt water.
Specifications
| Standards (select grades) | UL 94V-0, UL 746A, UL 94HB, UL 1203, NASA low outgassing, USP Class VI, FDA CFR 175.300 |
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- Master Bond Epoxy Adhesive Films & Preforms
- Master Bond UV Curable Adhesives
- Master Bond LED Light Curable Adhesives
- Master Bond UV Curing Potting Compounds
- Master Bond UV Curable Scratch Resistant Coatings
- Master Bond Conformal Coatings
- Master Bond Silicone Systems (MasterSil)
- Master Bond Polysulfide Modified Epoxies
- Master Bond Urethane Modified Epoxies
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