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Master Bond Consumable

UV Curing Potting Compounds

Model UV15-7SP4, UV18Med, UV15DC80, UV15X-6Med-2

Fast curing, single component UV potting compounds with high electrical insulation; specific grades cure up to 1/4 inch deep.

Description

These 100% solid, solvent-free UV curable potting compounds protect sensors, capacitors, connectors, detectors, inductors, switches and relays against moisture, chemicals, temperature extremes, thermal and mechanical shock and vibration. They bond to metals, ceramics and most plastics.

Featured grades

  • UV15-7SP4 – flexible, non-yellowing, 800 to 1,500 cps, cures up to 1/4 inch; -80°F to +250°F
  • UV18Med – USP Class VI and ISO 10993-5 approved
  • UV15DC80 – UV and heat curable for shadowed areas at temperatures as low as 80°C; -80°F to +350°F
  • UV15X-6Med-2 – flexible, USP Class VI biocompatible

Applications

Potting and encapsulation of small electronic components where fast cycle times are needed.

Specifications

Cure depthup to 1/4 inch
UV15-7SP4 viscosity800 to 1,500 cps
UV15DC80 heat cureas low as 80°C

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