Evans Group Component
Paktron Angstor Series (RA)
Self-encased stacked metallized film (MLP) capacitors for thru-hole use, 100-500 V and 0.1-10.0 µF, built with Paktron Interleaf technology.
Description
Angstor RA is a self-encased, stacked metallized film capacitor designed for thru-hole and wired applications. Paktron’s Interleaf technology uses high laminating pressure and linear stacking to create a multilayer polymer construction that resembles an MLCC in cross section while retaining the fail-safe advantages of a stacked plastic film capacitor. The RA series combines small size, high dv/dt capability, and very low ESR at high frequency with self-healing behavior and rugged construction.
Key features
- Type: Multilayer Polymer (MLP) Film
- Grade: Hi-Rel/ Rugged
- Dielectric/Construction: Self-encased, metallized film capacitor with aluminum electrodes and terminals pulse welded to the lead wires
- Rated Voltage: 100V-500V
- Capacitance: 0.1 μF to 10.0 μF @ 1 kHz
- Sizes: RA3, RA4, RA6 - see data sheet for representative dimensions
- Operating Temp: -55 °C to +125 °C
Applications
- High frequency switching power inputs
- Line and data line noise suppression
- EMI / RFI suppression
- 12V, 36V, 48V bus-rail filtering
- On-board converters (EV / HEV)
Specifications
| Type | Multilayer Polymer (MLP) Film |
|---|---|
| Grade | Hi-Rel/ Rugged |
| Dielectric/Construction | Self-encased, metallized film capacitor with aluminum electrodes and terminals pulse welded to the lead wires |
| Rated Voltage | 100V-500V |
| Capacitance | 0.1 μF to 10.0 μF @ 1 kHz |
| Sizes | RA3, RA4, RA6 - see data sheet for representative dimensions |
| Operating Temp | -55 °C to +125 °C |
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